Figure 1.2 Distance between holes
PS: a). The distance between hole plates is: A≥20mil;
b). The distance between hole plate and copper foil is: B≥20mil, C≥20mil;
c). The minimum distance between PTH and hole to outline is the distance that can ensure the distance from the bonding pad to the hole to outline is: D≥20mil;
d). The recommended minimum distance between NPTH and hole to outline is E≥40mil.
The through holes cannot be designed on bonding pad, and they should be connected by a short printed line, the distance from hole wall to bonding pad must be greater than 0.2 mm, otherwise it is easier to produce flaws such as tombstone setting, useless soldering, and less tin, which is shown as follow:
Figure 1.3 The Location Design of Through Hole
Figure 1.5 Incorrect Design of Through Hole Position
Figure 2.1 Types of Holes
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