IoT Technologies & Main Platforms
Key components of IoT hardware include: Processor, Sensors, Communication modules, Memory/Storage, Power Supply, and External Interfaces such as display, camera, and speaker.
Engineering Validation Capabilities
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Set up test environment & execution
Establishing test environments and conducting product testing. This involves designing and fabricating test fixtures, flashing embedded programs, executing tests according to provided instructions, recording results, and creating comprehensive test reports.
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Problem Analysis
Conducting product schematic and circuit analysis to diagnose faults and analyze problems. Tracing functional anomalies and combining test data with logs to pinpoint issues and recommend solutions, thereby enhancing system stability and reliability. Standardizing problem descriptions and documenting solutions to facilitate team knowledge sharing and ongoing improvement.
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Certification Testing
With engineer experience and access to authorized laboratory resources, we support testing across multiple standards, including RF, safety, EMC, ESD, and more. From pre-testing of modules and products to testing execution and feedback during the certification phase, we provide end-to-end assistance.
Design Review & DFX
Leveraging engineers’ and resource grasp of technical principles and component specifications, alongside industry best practices, we assess design rationality. Our expertise extends to analyzing schematic design issues and reviewing PCB layout designs.
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Align Quality Standards
Leveraging engineering and process expertise, alongside industry standards and supply chain resources, we evaluate functional and process specifications to establish practical technical specifications, quality acceptance criteria, and testing methodologies. This technical validation phase sets the acceptance standards for mass production, guaranteeing that the product fulfills requirements for functionality, reliability, consistency, and compliance across design, testing, and manufacturing. Our experience includes but not limited to the Battery selection, RF and antenna performance evaluation, and familiarity with key industry standards like IPC and IEC.
Manufacturing Capabilities
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PCB Fabrication
Supports up to 68 layers, with Min Traces/Space at 3 mil. Microvia-based any layer HDI PCB is also capable.
PCB Assembly
Precise connections for components like BGAs (pitch > 0.25mm). Tested with X-Ray checks.
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