Electronics Engineering / Manufacturing
Electronic Engineering to Accelerate New Product Development & Validation
IoT Technologies & Main Platforms
Key components of IoT hardware include: Processor, Sensors, Communication modules, Memory/Storage, Power Supply, and External Interfaces such as display, camera, and speaker.
Sensors
30+ sensor modalitiesPhysical
- Temp, Humidity, Pressure, Vibration, Force, Flow, Level
Inertial & Position
- IMU 9-DOF (Accel/Gyro/Mag), GNSS, UWB, Radar, Hall
Optical & Imaging
- CMOS, TOF, LiDAR, IR, Ambient Light, UV
Biomedical
- PPG, ECG, EEG, EMG, Bioimpedance, GSR
Chemical & Acoustic
- Chemical, Acoustic, pH/ORP, Gas, Do, Ultrasonic
Compute & Storage
MCU to SoC + AI at edgeProcessors
- MCU: Cortex-M0/M4/M7, RISC-V (eg. STM32, ESP32, nRF52, iMX8)
Accelerators
- FPGA, NPU, DSP
Memory & Storage
- SRAM/PSRAM, DRAM/LPDDR4/5, NOR/NAND Flash, eMMC/SD/NVMe
Security
- Secure Element (ATECC608, OPTIGA Trust), TPM 2.0, Crypto HW
Operating System
- Linux, RTOS, Bare-metal, Zephyr, Arduino, TinyML
Network
Sub-GHz to mmWaveWired
- Ethernet (10/100/GbE), USB 2.0/3.x/TyPe-C, UART/SPI/I2C/I2S, CAN/RS-485/RS-232, Fibre optic/MIPI/PCIe
Wireless (short range ~100m)
- Wi-Fi 4/5/6/6E/7, BLE 5.x/BT Classic, Zigbee, Thread, Matter, UWB, NFC, RFID
Wireless (long range ~15km+)
- LoRa/LoRaWAN, NB-IOT, LTE Cat-M1, 4G/5G NR
RF & Antenna
- PCB Ant., Chip Ant., External
- RF Front-end/PA, LNA/Filters/SAW
User Interface
Sense → DEcide → ActDisplay
- OLED, TFT/IPS, E-Paper
- MIPI DSI, HDMI, LVDS, SPI
Input
- Capacitive/resistive touch
- Button/rotary encoder
- Fingerprint/face/voice
- Gesture (IR/ToF/Radar)
Output
- Audio, Haptic, LED
Actuators
- DC/stepper/servo/BLDC
- H-bridge/gate driver
- Relay/Solenoid/Valve
- eg. DRV8825, TMC2209, L298N
Camera & Video
- MIPICSI-2/USB UVC
Power
uW to 240W deliveryRegulation
- PMIC: 3.3V (MCU), 1.8V (RAM), 2.8V (Sensor), 5V (USB)
- LDO, Buck, Boost, Buck-Boost
Battery & Charging
- Li-Po, Li-lon, LiFePO4
- BMS, Fuel guage
- charger IC (BQ2407x)
- Supercapacitor, Qi
Energy Harvesting
- Solar, Thermoelectric, Vib/RF
Delivery & Protection
- USB-CPD 3.1/PoE
- ESD/TVS/Fuse/OVP
- Galvanic isolation