Electronics Engineering / Manufacturing

Electronic Engineering to Accelerate New Product Development & Validation

IoT Technologies & Main Platforms

Key components of IoT hardware include: Processor, Sensors, Communication modules, Memory/Storage, Power Supply, and External Interfaces such as display, camera, and speaker.

tab1 tab2 tab3 tab4 tab5

Sensors

30+ sensor modalities
Physical
  • Temp, Humidity, Pressure, Vibration, Force, Flow, Level
Inertial & Position
  • IMU 9-DOF (Accel/Gyro/Mag), GNSS, UWB, Radar, Hall
Optical & Imaging
  • CMOS, TOF, LiDAR, IR, Ambient Light, UV
Biomedical
  • PPG, ECG, EEG, EMG, Bioimpedance, GSR
Chemical & Acoustic
  • Chemical, Acoustic, pH/ORP, Gas, Do, Ultrasonic

Compute & Storage

MCU to SoC + AI at edge
Processors
  • MCU: Cortex-M0/M4/M7, RISC-V (eg. STM32, ESP32, nRF52, iMX8)
Accelerators
  • FPGA, NPU, DSP
Memory & Storage
  • SRAM/PSRAM, DRAM/LPDDR4/5, NOR/NAND Flash, eMMC/SD/NVMe
Security
  • Secure Element (ATECC608, OPTIGA Trust), TPM 2.0, Crypto HW
Operating System
  • Linux, RTOS, Bare-metal, Zephyr, Arduino, TinyML

Network

Sub-GHz to mmWave
Wired
  • Ethernet (10/100/GbE), USB 2.0/3.x/TyPe-C, UART/SPI/I2C/I2S, CAN/RS-485/RS-232, Fibre optic/MIPI/PCIe
Wireless (short range ~100m)
  • Wi-Fi 4/5/6/6E/7, BLE 5.x/BT Classic, Zigbee, Thread, Matter, UWB, NFC, RFID
Wireless (long range ~15km+)
  • LoRa/LoRaWAN, NB-IOT, LTE Cat-M1, 4G/5G NR
RF & Antenna
  • PCB Ant., Chip Ant., External
  • RF Front-end/PA, LNA/Filters/SAW

User Interface

Sense → DEcide → Act
Display
  • OLED, TFT/IPS, E-Paper
  • MIPI DSI, HDMI, LVDS, SPI
Input
  • Capacitive/resistive touch
  • Button/rotary encoder
  • Fingerprint/face/voice
  • Gesture (IR/ToF/Radar)
Output
  • Audio, Haptic, LED
Actuators
  • DC/stepper/servo/BLDC
  • H-bridge/gate driver
  • Relay/Solenoid/Valve
  • eg. DRV8825, TMC2209, L298N
Camera & Video
  • MIPICSI-2/USB UVC

Power

uW to 240W delivery
Regulation
  • PMIC: 3.3V (MCU), 1.8V (RAM), 2.8V (Sensor), 5V (USB)
  • LDO, Buck, Boost, Buck-Boost
Battery & Charging
  • Li-Po, Li-lon, LiFePO4
  • BMS, Fuel guage
  • charger IC (BQ2407x)
  • Supercapacitor, Qi
Energy Harvesting
  • Solar, Thermoelectric, Vib/RF
Delivery & Protection
  • USB-CPD 3.1/PoE
  • ESD/TVS/Fuse/OVP
  • Galvanic isolation