The world is looking forward to your hardware innovation

📅 Date: May 12–13, 2026
📍 Location: Hyatt Regency Boston Hotel, One Ave de Lafayette, Boston, MA 02111, USA

Event detail

We’re excited to announce that NexPCB will be attending TECHSPO Boston 2026, a two-day technology expo where business, technology, and innovation collide in Boston.

TECHSPO Boston brings together developers, brands, marketers, technology providers, designers, innovators, and technology leaders exploring the next generation of Internet, Mobile, AdTech, MarTech, SaaS, and digital innovation. For teams working on wearable devices, connected products, IoT systems, smart sensors, and other electronics-driven solutions, it is also a valuable place to connect digital ideas with real-world hardware execution.

At TECHSPO Boston 2026, meet the NexPCB team to:

• Discuss how to move your hardware project from concept and prototype to pilot builds and production.
• Learn about NexPCB’s support in PCB fabrication, PCBA manufacturing, DFM, component sourcing, testing, and final assembly.
• Explore practical solutions for wearable and connected-device challenges, including miniaturization, reliability, power management, manufacturability, and supply chain readiness.
• Share your current project, technical bottlenecks, or production roadmap and get feedback from a team experienced in hardware product realization.
• Connect with the broader technology community and explore how physical products can integrate with software, data, and digital platforms.

As digital products become more connected, intelligent, and personalized, reliable hardware execution becomes even more critical. A great wearable or connected device is not built on software alone. It requires manufacturable electronics, dependable assembly, tested components, and a production strategy that can support real users at scale.

Meet NexPCB at TECHSPO Boston 2026 to explore how we support hardware teams through:

• PCB fabrication for prototypes, pilot runs, and production builds.
• PCBA manufacturing and turnkey electronics assembly.
• DFM, DFA, and production-readiness review.
• Component sourcing and supply chain coordination.
• NPI support from early engineering builds to scalable manufacturing.
• Functional testing, inspection planning, and quality control.
• Mechanical parts, enclosure integration, and final product assembly.
• Manufacturing support for startups, OEMs, innovation teams, and companies building connected devices.

Whether you are developing a wearable device, preparing an IoT product for launch, improving your electronics design, or looking for a manufacturing partner who can support your product from prototype to production, NexPCB is ready to help.

If you’re attending TECHSPO Boston 2026, let’s connect and talk about how to bring your next hardware innovation to life.