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NexPCB Blog
Everything you need to get started to manufacture awesome IoT products. PCB, PCBA, EMS, SMT, Supply Chain and Sourcing.
Voids In Solder Joaints
Voids in solder joints are a significant problem facing industrial products, especially in power...
A quick look at FDM 3D printing
Fused Deposition Modeling (FDM), or Fused Filament Fabrication (FFF) is an additive...
An introduction to 3D printing
3D printing technology (also called Rapid Prototyping) is an additive computer-controlled...
SMT Passive Parts (Reference Article)
If you're looking for a handy reference for SMT parts, this may be a great place to start. We...
System In Package Technology
A System In a Package (SIP) is a functional package that integrates multiple functional chips,...
Static electricity
If you've ever handled any type of pre-consumer electronics, you've probably seen labels warning...
What is a gerber file and how to get one?
Gerber files are the most common and most widely used file formats in the electronics assembly...SMT quality management
With the transition of product-oriented to more market-oriented (aka customer-oriented) business...
The Guide to SMT Material Package Type: Chip Capacitor
Capacitors are usually indicated by symbols such as C, CN, EC, TC, PC, BC with numbers appended...
The Guide to SMT Material Packaging: Chip Resistor
The obstructive effect of an object on the passage of electric current is called resistance....
How to use SMT Red Glue
SMT red glue is certain type of temperature-set adhesive that is used during the SMT process to...
Basics of the SMT Reflow Soldering Temperature Plate
Reflow soldering is the most common method used by SMT to bond electronic components to printed...