NexPCB Blog

Explore Semiconductor Packaging Technologies: PoP, SiP, TSV, and more

Guide to Optimizing IoT Device Packaging

As IoT expands into new industries, selecting the correct packaging materials becomes increasingly...

San Diego's 1st Hardware Meetup (Sponsored by NexPCB)

Last March, NexPCB sponsored the First San Diego Hardware Meetup which Nate Padget organized. The...

Establishing Quality Control Strategies for Hardware Startups

In the competitive world of startups, products ought to have as minimum flaws as possible to grow...

The 3 Pillars of Hardware Startup Success: Quality, Time, and Cost

The Role of Quality in Hardware Startups' Product Development Journey

Guide to Quality Optimization: SPC, Six Sigma, TPC, Lean Manufacturing

Looking through the Lens of Hardware Startups: QC vs QA vs QM

While QM includes a wider range of actions aimed at controlling quality across the whole product...

IoT Device Design 101: Battery and Software Optimization

7 Hardware Accelerators to Join in 2023

EVT, DVT, PVT... Your Last Steps to Launching Your IoT Product!

Prototyping Stages: Looks-like, Works-like Prototypes

5 Ways You Can Prototype like Meta's VR Team

In a recent interview on Adam Savage’s Tested YouTube channel, Mark Zuckerberg and his team...

Design to Production: All the Software To Launch Your IoT Project!

Prototyping Electronics: Tools for Your First IoT Prototype

Machining Tools to Prototype Your First IoT Project