NexPCB Blog

Everything you need to get started to manufacture awesome IoT products. PCB, PCBA, EMS, SMT, Supply Chain and Sourcing.

A quick look at FDM 3D printing

Fused Deposition Modeling (FDM), or Fused Filament Fabrication (FFF) is an additive...

An introduction to 3D printing

3D printing technology (also called Rapid Prototyping) is an additive computer-controlled...

SMT Passive Parts (Reference Article)

If you're looking for a handy reference for SMT parts, this may be a great place to start. We...

System In Package Technology

A System In a Package (SIP) is a functional package that integrates multiple functional chips,...

Static electricity

If you've ever handled any type of pre-consumer electronics, you've probably seen labels warning...

What is a gerber file and how to get one?

Gerber files are the most common and most widely used file formats in the electronics assembly...

SMT quality management

With the transition of product-oriented to more market-oriented (aka customer-oriented) business...

The Guide to SMT Material Package Type: Chip Capacitor

Capacitors are usually indicated by symbols such as C, CN, EC, TC, PC, BC with numbers appended...

The Guide to SMT Material Packaging: Chip Resistor

The obstructive effect of an object on the passage of electric current is called resistance. ...

How to use SMT Red Glue

SMT red glue is a temperature-set adhesive that is used during the SMD process to fix certain...

Basics of the SMT Reflow Soldering Temperature Plate

Reflow soldering is the most common method used by SMT to bond electronic components to printed...

The Guide to SMT material package type: Standard Parts

SMT involves a wide variety of parts and styles, many of which have formed industry-wide...

The Basics of DIP Wave Soldering

With the mass production of electronic products, the method of manual welding is no longer...