PCB Capabilities

Supports up to 68 layers, with Min Traces/Space at 3 mil. Microvia-based any layer HDI PCB is also capable.

PCB specifications

Standard Advanced
Layers 24 68
Max. dimensions 584 mm x 608 mm (±0.13 mm) 550 mm x 900 mm (±0.1 mm)
Board thickness 0.2 - 3.2 mm (±10%) 0.1 - 6.5 mm (±8%)
Finished copper weight (outer) 1 - 5 oz 1 - 18 oz
Finished copper weight (inner) 0.5 - 3 oz 1/3 - 12 oz

Drill/Hole size

Standard Advanced
Drill hole size 0.2 - 6.5 mm 0.15 - 6.5 mm
Max. finished hole diameter 6.35 mm Unlimited
Min. finished hole diameter 0.2 mm 0.1 mm
Min. via hole size 0.2 mm 0.1 mm
PTH hole size 0.2 - 6.35 mm 0.2 - 6.35 mm
Min. non-plated hole size 0.5 mm 0.2 mm
Min. plated slots 0.5 mm 0.2 mm
Min. non-plated slots 0.5 mm 0.2 mm
Hole size tolerance (plated) ±0.075 mm ±0.075 mm
Max. drill hole aspect ratio 10:1 25:1

Annular ring

Standard Advanced
Outer layer 4 mil (0.1 mm) 3 mil (0.08 mm)
Inner layer 4 mil (0.1 mm) 3 mil (0.08 mm)

Clearance

Standard Advanced
Hole to hole clearance (different net) 14 mil (0.356 mm) 12 mil (0.3 mm)
Hole position tolerance ±2 mil (0.05 mm) ±2 mil (0.05 mm)
Via to via clearance (same nets) 8 mil (0.2 mm) 6 mil (0.15 mm)
Pad to pad clearance 8 mil (0.2 mm) 6 mil (0.15 mm)
Via to track 8 mil (0.2 mm) 6 mil (0.152 mm)
PTH to track 8 mil (0.2 mm) 7 mil (0.178 mm)
NPTH to track 8 mil (0.2 mm) 5 mil (0.127 mm)
Pad to track 3 mil (0.076 mm) 3 mil (0.076 mm)

Trace width and spacing

Copper weight Min. trace width (standard) Min. spacing (standard) Min. trace width (advance) Min. spacing (advanced)
Outer layer 1/3 oz 4 mil 4 mil 3 mil 3 mil
Outer layer 0.5 oz 4 mil 4 mil 4 mil 3 mil
Outer layer 1 oz 4 mil 4 mil 5 mil 4 mil
Outer layer 2 oz 8 mil 8 mil 8 mil 5 mil
Outer layer 3 oz 12 mil 12 mil 10 mil 7 mil
Inner layer 0.5 oz 3 mil 3 mil 2.5 mil 2 mil
Inner layer 1 oz 4 mil 4 mil 3 mil 3 mil
Inner layer 2 oz 4 mil 4 mil 3 mil 3 mil
Inner layer 3 oz 12 mil 12 mil 9 mil 6 mil

BGA

Standard Advanced
BGA pad diameter 10 mil 8 mil
BGA pad distance 8mil 6mil

Solder mask

Standard Advanced
Soldermask expansion 2 mil 1 mil
Min. solder bridge 3.5 mil 3 mil
Via covering Epoxy filled & capped. Copper paste filled & capped. Epoxy filled & capped. Copper paste filled & capped.
Solder mask clearance 2mil (0.05mm) 2mil (0.05mm)

Silkscreen

Standard Advanced
Min. character distance 6 mil 4 mil
Min. line width 6 mil 4 mil
Min. text height 30 mil 30 mil
Pad to silkscreen 5 mil 5 mil
Color White, Black, Yellow White, Black, Yellow

Board outline

Standard Advanced
Min. trace to outline 12 mil (0.3mm) 10 mil (0.25mm)
Hole to outline 16 mil (0.4 mm) 12 mil (0.3 mm)