PCB Capabilities
Supports up to 68 layers, with Min Traces/Space at 3 mil. Microvia-based any layer HDI PCB is also capable.
PCB specifications
| Standard | Advanced | |
|---|---|---|
| Layers | 24 | 68 |
| Max. dimensions | 584 mm x 608 mm (±0.13 mm) | 550 mm x 900 mm (±0.1 mm) |
| Board thickness | 0.2 - 3.2 mm (±10%) | 0.1 - 6.5 mm (±8%) |
| Finished copper weight (outer) | 1 - 5 oz | 1 - 18 oz |
| Finished copper weight (inner) | 0.5 - 3 oz | 1/3 - 12 oz |
Drill/Hole size
| Standard | Advanced | |
|---|---|---|
| Drill hole size | 0.2 - 6.5 mm | 0.15 - 6.5 mm |
| Max. finished hole diameter | 6.35 mm | Unlimited |
| Min. finished hole diameter | 0.2 mm | 0.1 mm |
| Min. via hole size | 0.2 mm | 0.1 mm |
| PTH hole size | 0.2 - 6.35 mm | 0.2 - 6.35 mm |
| Min. non-plated hole size | 0.5 mm | 0.2 mm |
| Min. plated slots | 0.5 mm | 0.2 mm |
| Min. non-plated slots | 0.5 mm | 0.2 mm |
| Hole size tolerance (plated) | ±0.075 mm | ±0.075 mm |
| Max. drill hole aspect ratio | 10:1 | 25:1 |
Annular ring
| Standard | Advanced | |
|---|---|---|
| Outer layer | 4 mil (0.1 mm) | 3 mil (0.08 mm) |
| Inner layer | 4 mil (0.1 mm) | 3 mil (0.08 mm) |
Clearance
| Standard | Advanced | |
|---|---|---|
| Hole to hole clearance (different net) | 14 mil (0.356 mm) | 12 mil (0.3 mm) |
| Hole position tolerance | ±2 mil (0.05 mm) | ±2 mil (0.05 mm) |
| Via to via clearance (same nets) | 8 mil (0.2 mm) | 6 mil (0.15 mm) |
| Pad to pad clearance | 8 mil (0.2 mm) | 6 mil (0.15 mm) |
| Via to track | 8 mil (0.2 mm) | 6 mil (0.152 mm) |
| PTH to track | 8 mil (0.2 mm) | 7 mil (0.178 mm) |
| NPTH to track | 8 mil (0.2 mm) | 5 mil (0.127 mm) |
| Pad to track | 3 mil (0.076 mm) | 3 mil (0.076 mm) |
Trace width and spacing
| Copper weight | Min. trace width (standard) | Min. spacing (standard) | Min. trace width (advance) | Min. spacing (advanced) | |
|---|---|---|---|---|---|
| Outer layer | 1/3 oz | 4 mil | 4 mil | 3 mil | 3 mil |
| Outer layer | 0.5 oz | 4 mil | 4 mil | 4 mil | 3 mil |
| Outer layer | 1 oz | 4 mil | 4 mil | 5 mil | 4 mil |
| Outer layer | 2 oz | 8 mil | 8 mil | 8 mil | 5 mil |
| Outer layer | 3 oz | 12 mil | 12 mil | 10 mil | 7 mil |
| Inner layer | 0.5 oz | 3 mil | 3 mil | 2.5 mil | 2 mil |
| Inner layer | 1 oz | 4 mil | 4 mil | 3 mil | 3 mil |
| Inner layer | 2 oz | 4 mil | 4 mil | 3 mil | 3 mil |
| Inner layer | 3 oz | 12 mil | 12 mil | 9 mil | 6 mil |
BGA
| Standard | Advanced | |
|---|---|---|
| BGA pad diameter | 10 mil | 8 mil |
| BGA pad distance | 8mil | 6mil |
Solder mask
| Standard | Advanced | |
|---|---|---|
| Soldermask expansion | 2 mil | 1 mil |
| Min. solder bridge | 3.5 mil | 3 mil |
| Via covering | Epoxy filled & capped. Copper paste filled & capped. | Epoxy filled & capped. Copper paste filled & capped. |
| Solder mask clearance | 2mil (0.05mm) | 2mil (0.05mm) |
Silkscreen
| Standard | Advanced | |
|---|---|---|
| Min. character distance | 6 mil | 4 mil |
| Min. line width | 6 mil | 4 mil |
| Min. text height | 30 mil | 30 mil |
| Pad to silkscreen | 5 mil | 5 mil |
| Color | White, Black, Yellow | White, Black, Yellow |
Board outline
| Standard | Advanced | |
|---|---|---|
| Min. trace to outline | 12 mil (0.3mm) | 10 mil (0.25mm) |
| Hole to outline | 16 mil (0.4 mm) | 12 mil (0.3 mm) |