High Density Interconnect (HDI) PCB
Supports up to 68 layers, with Min Traces/Space at 3 mil. Microvia-based any layer HDI PCB is also capable.
PCB specifications
| Standard | Advanced | |
|---|---|---|
| Layers | 16 | 28 |
| Max. dimensions | 450 mm x 600 mm | 450 mm x 600 mm |
| Board thickness | 3 mm | 4 mm |
| uVia copper thickness | 0.015 mm | 0.02 mm |
| Blind via plating | Support | Support |
| Buried via copper thickness | 0.02 mm | 0.035 mm |
| Max uVia aspect ratio | 0.8 | 1:1 |
| uVia hole position tolerance | ±0.05 mm | ±0.05 mm |
Drill/Hole size
| Standard | Advanced | |
|---|---|---|
| uVia diameter | 5 mil | 3 mil |
| Min. uVia target pad diameter | 10 mil | 10 mil |
| Min. uVia target pad diameter | 12 mil | 8 mil |
| Buried via diameter | 0.15 mm | 0.15 mm |
| Min. buried via pad diameter | 0.3 mm | 0.3 mm |
| POFV + stacked holes | Support | Support |
| Min. buried via and uVia spacing, same net | 8 mil | 6 mil |
| Min. buried via and uVia spacing, different net | 12 mil | 12 mil |
Trace width and spacing
| Copper weight | Min. trace width (standard) | Min. spacing (standard) | Min. trace width (advance) | Min. spacing (advanced) | |
|---|---|---|---|---|---|
| Outer layer | 1/3 oz | 3 mil | 3 mil | 2.5 mil | 2.5 mil |
| Outer layer | 0.5 oz | Not supported | Not supported | Not supported | Not supported |
| 2nd outer layer | 1/3 oz | 3 mil | 3 mil | 2.5 mil | 2.5 mil |
| 2nd outer layer | 0.5 oz | 4 mil | 4 mil | 2.5 mil | 2.5 mil |
| Inner layer | 0.5 oz | 3 mil | 3 mil | 2 mil | 2.5 mil |
| Inner layer | 1 oz | 4 mil | 4 mil | 3 mil | 3 mil |
| Inner layer | 2 oz | 6 mil | 6 mil | 5.5 mil | 5.5 mil |
| Inner layer | 3 oz | 7 mil | 7 mil | 6 mil | 6.5 mil |