Liang Guo

Liang is a skillful Electronics Engineer with an ability to solder almost anything. By anything, we mean 15+ year old shattered HDD Circuitry to retro gaming consoles .

Voids In Solder Joaints

Voids in solder joints are a significant problem facing industrial products, especially in power...

SMT Passive Parts (Reference Article)

If you're looking for a handy reference for SMT parts, this may be a great place to start. We have...

System In Package Technology

A System In a Package (SIP) is a functional package that integrates multiple functional chips,...

Static electricity

If you've ever handled any type of pre-consumer electronics, you've probably seen labels warning...

SMT quality management

With the transition of product-oriented to more market-oriented (aka customer-oriented) business...

The Guide to SMT Material Package Type: Chip Capacitor

Capacitors are usually indicated by symbols such as C, CN, EC, TC, PC, BC with numbers appended to...

The Guide to SMT Material Packaging: Chip Resistor

The obstructive effect of an object on the passage of electric current is called resistance....

How to use SMT Red Glue

SMT red glue is certain type of temperature-set adhesive that is used during the SMT process to fix...

Basics of the SMT Reflow Soldering Temperature Plate

Reflow soldering is the most common method used by SMT to bond electronic components to printed...

The Guide to SMT material package type: Standard Parts

SMT involves a wide variety of parts and styles, many of which have formed become industry-wide...

The Basics of DIP Wave Soldering

With the mass production of electronic products, the method of manual welding is no longer...

What is A SMT Solder Paste Injection System ?

A Solder Paste Inspection system, also known as SPI, is a solder paste detection system. The main...

SMT Reflow Soldering Temperature Curve

Reflow soldering is an extremely vital step in the SMT(Surface Mount Technology) process. The...

What is SMT Nitrogen reflow soldering?

With the increase of assembly density and the appearance of fine spacing assembly technology,...

SMT BGA Solder Joint Slice Analysis

With the continued shrinking of electronic components and the addition of many BGAs to electronic...