Voids In Solder Joints

Voids in solder joints are a significant problem facing industrial products, especially in power...

An Introduction to FPC materials

SMT Passive Parts (Reference Article)

If you're looking for a handy reference for SMT parts, this may be a great place to start. We...

System In Package Technology

A System In a Package (SIP) is a functional package that integrates multiple functional chips,...

Static electricity

If you've ever handled any type of pre-consumer electronics, you've probably seen labels warning...

What is a gerber file and how to get one?

The Guide to SMT Material Package Type: Chip Capacitor

Capacitors are usually indicated by symbols such as C, CN, EC, TC, PC, BC with numbers appended...

The Guide to SMT Material Packaging: Chip Resistor

The obstructive effect of an object on the passage of electric current is called resistance. ...

How to use SMT Red Glue

SMT red glue is a temperature-set adhesive that is used during the SMD process to fix certain...

Basics of the SMT Reflow Soldering Temperature Plate

Reflow soldering is the most common method used by SMT to bond electronic components to printed...

The Basics of DIP Wave Soldering

With the mass production of electronic products, the method of manual welding is no longer...

How to deal with insufficient solder and excess solder in PCBA

In the process of the PCBA production, there are several common problems may occur including tin...

SMT Reflow Soldering Temperature Curve

Reflow soldering is an extremely vital step in the SMT(Surface Mount Technology) process. The...

What is SMT Nitrogen reflow soldering?

With the increase of assembly density and the appearance of fine spacing assembly technology,...

SMT BGA Solder Joint Slice Analysis

With the continued shrinking of electronic components and the addition of many BGAs to...

SMT Stencil: SMT Steel Mesh

SMT steel mesh, which is used to consistently distribute solder paste or patch glue, is the...