System In Package Technology
A System In a Package (SIP) is a functional package that integrates multiple functional chips,...
NexPCB Blog
Everything you need to get started to manufacture awesome IoT products. PCB, PCBA, EMS, SMT, Supply Chain and Sourcing.
Static electricity
If you've ever handled any type of pre-consumer electronics, you've probably seen labels warning...
What is a gerber file and how to get one?
Gerber files are the most common and most widely used file formats in the electronics assembly...SMT quality management
With the transition of product-oriented to more market-oriented (aka customer-oriented) business...
The Guide to SMT Material Package Type: Chip Capacitor
Capacitors are usually indicated by symbols such as C, CN, EC, TC, PC, BC with numbers appended to...
The Guide to SMT Material Packaging: Chip Resistor
The obstructive effect of an object on the passage of electric current is called resistance....
How to use SMT Red Glue
SMT red glue is certain type of temperature-set adhesive that is used during the SMT process to fix...
Basics of the SMT Reflow Soldering Temperature Plate
Reflow soldering is the most common method used by SMT to bond electronic components to printed...
The Guide to SMT material package type: Standard Parts
SMT involves a wide variety of parts and styles, many of which have formed become industry-wide...
The Basics of DIP Wave Soldering
With the mass production of electronic products, the method of manual welding is no longer...
What is A SMT Solder Paste Injection System ?
A Solder Paste Inspection system, also known as SPI, is a solder paste detection system. The main...
Reinforcing Rib Structure Design for Plastic Parts
In a previous article, we discussed a bit on rib design and the reasons that you'd want to have...
The most common thermoplastic material properties
In daily life, injection materials can be seen everywhere. They are described with a jumble of...
How to deal with insufficient solder and excess solder in PCBA
In the process of the PCBA production, there are several common problems may occur including tin...